Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Reexamination Certificate
2005-03-29
2005-03-29
Chen, Bret (Department: 1762)
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
C427S535000, C438S785000
Reexamination Certificate
active
06872429
ABSTRACT:
A layer of tungsten nitride is deposited on the upper surface of a wafer with improved adhesion. The deposition is performed by first pretreating the wafer with a hydrogen plasma prior to performing tungsten nitride deposition.
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Lu et al. “A New Process for Depositing Tungsten Nitride Thin Films”J.Electrochem. Soc., vol. 145, No. 2, pp. L21-L23, Feb. 1998.
Chen Ling
Ganguli Seshadri
Mak Alfred
Applied Materials Inc.
Chen Bret
Moser Patterson & Sheridan LLP.
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