Deposition methods

Details Deposition methods Deposition methods

2005-05-10

2005-05-10

Meeks, Timothy (Department: 1762)

Coating processes

Coating by vapor, gas, or smoke

C427S535000, C427S569000, C427S237000, C134S001100, C134S022100

Reexamination Certificate

active

06890596

ABSTRACT:
A deposition method includes positioning a substrate within a deposition chamber defined at least in part by chamber walls. At least one of the chamber walls comprises a chamber surface having a plurality of purge gas inlets to the chamber therein. A process gas is provided over the substrate effective to deposit a layer onto the substrate. During such providing, a material adheres to the chamber surface. Reactive purge gas is emitted to the deposition chamber from the purge gas inlets effective to form a reactive gas curtain over the chamber surface and away from the substrate, with such reactive gas reacting with such adhering material. Further implementations are contemplated.

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