Deposition method

Details Deposition method Deposition method

1998-02-13

2000-01-18

Meeks, Timothy

Coating processes

Coating by vapor, gas, or smoke

Mixture of vapors or gases utilized

42725527, C23C 1644

Patent

active

060155914

ABSTRACT:
An improved deposition chamber (2) includes a housing (4) defining a vacuum chamber (18) which houses a substrate support (14). A set of first nozzles (34) have orifices (38) opening into the vacuum chamber in a circumferential pattern spaced apart from and generally overlying the periphery (40) of the substrate support. One or more seconds nozzle (56, 56a), positioned centrally above the substrate support, inject process gases into the vacuum chamber to improve deposition thickness uniformity. Deposition thickness uniformity is also improved by ensuring that the process gases are supplied to the first nozzles at the same pressure. If needed, enhanced cleaning of the nozzles can be achieved by slowly drawing a cleaning gas from within the vacuum chamber in a reverse flow direction through the nozzles using a vacuum pump (84).

REFERENCES:
patent: 3717439 (1973-02-01), Sakai
patent: 4716852 (1988-01-01), Tsujii et al.
patent: 4817558 (1989-04-01), Itoh
patent: 5069930 (1991-12-01), Hussla et al.
patent: 5093152 (1992-03-01), Bonet et al.
patent: 5105761 (1992-04-01), Charlet et al.
patent: 5192370 (1993-03-01), Oda et al.
patent: 5250092 (1993-10-01), Nakano
patent: 5292554 (1994-03-01), Sinha et al.
patent: 5304398 (1994-04-01), Krusell et al.
patent: 5346578 (1994-09-01), Benzing et al.
patent: 5368646 (1994-11-01), Yasuda et al.
patent: 5522934 (1996-06-01), Suzuki et al.
patent: 5525159 (1996-06-01), Hama et al.
patent: 5532190 (1996-07-01), Goodyear et al.
patent: 5554226 (1996-09-01), Okase et al.
patent: 5614055 (1997-03-01), Fairbairn et al.
patent: 5620523 (1997-04-01), Maeda et al.
L. H. Kaplan and I. Ames, "Deposition Method for Aluminum Oxide Films", IBM Technical Disclosure Bulletin, vol. 7, No. 5, pp. 414-415, Oct. 1964.

Affiliated with

Also associated with

Rating

Deposition method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Deposition method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Deposition method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-561403