Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent
1997-08-25
1999-11-02
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
257739, H01L 2348, H01L 2352, H01L 2940
Patent
active
059776420
ABSTRACT:
A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a dielectric insulation material over the first conductive surface such that the dendrites are exposed through the insulation material to leave a substantially planar surface of exposed dendrites, and placing a second conductive surface on top of the exposed dendrites. The second conductive surface may be a surface metal, a chip bump array, or a ball grid array. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection and planarization manufactured in accordance with the present invention.
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Appelt Bernd K.
Datta Saswati
Gaynes Michael A.
Lauffer John M.
Wilcox James R.
Clark Sheila V.
International Business Machines - Corporation
Lucas James A.
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