Metal fusion bonding – Process – With subsequent treating other than heating of bonded parts...
Patent
1997-12-08
2000-04-18
Ryan, Patrick
Metal fusion bonding
Process
With subsequent treating other than heating of bonded parts...
134 3, 134 28, B23K 2800, C23G 102, B08B 300
Patent
active
06050479&
ABSTRACT:
The defluxing agent for flux residue after soldering contains an acid (preferably an organic acid, and particularly an acid stronger than abietic acid; for example, acrylic acid, acetic acid, propionic acid, benzoic acid) and an organic solvent (for example, xylene, benzyl acetate, methyl .alpha.-hydroxyisobutyrate, cyclohexanone, methyl .beta.-methoxyisobutyrate), and if necessary it further contains a monohydric alcohol, a surfactant and a corrosion inhibitor. Rinsing is preferably performed after the cleaning, using a solvent which is miscible with the defluxing agent, in order to completely remove the acid. There is also disclosed a cleaning apparatus which may be generally used for this and other cleaning.
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Igusa Nobuo
Ochiai Masayuki
Takachi Isamu
Watanabe Keiji
Yamagishi Yasuo
Fujitsu Ltd.
Ryan Patrick
Stoner Kiley
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