4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Masayuki Ochiai

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Bump-forming method using two plates and electronic device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Cleaning method using a defluxing agent

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent

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Defluxing agent cleaning method and cleaning apparatus

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Patent

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Defluxing agent cleaning method and cleaning apparatus

Metal fusion bonding – Process – With subsequent treating other than heating of bonded parts...
Patent

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Fluid bearing device

Bearings – Rotary bearing – Fluid bearing
Reexamination Certificate

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Profile ID: LFUS-PAI-P-444219

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