Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Patent
1997-10-22
1999-04-06
Niebling, John F.
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
438151, 438412, 438430, 438164, 438589, H01L 2100
Patent
active
058917632
ABSTRACT:
The present invention is a technique for producing planar silicon on insulator MOS transistors, where the channel regions are created in an underlying single crystal silicon wafer, and where the source-drain extension regions are created by damascene patterning a thin film of amorphous silicon deposited on a layer of oxide deposited on the silicon wafer.
REFERENCES:
patent: 4675984 (1987-06-01), Hsu
patent: 4758531 (1988-07-01), Beyer et al.
patent: 4835585 (1989-05-01), Panousis
patent: 4876217 (1989-10-01), Zdebel
patent: 5011783 (1991-04-01), Ogawa et al.
patent: 5093273 (1992-03-01), Okumura
patent: 5185280 (1993-02-01), Houston et al.
patent: 5597739 (1997-01-01), Sumi et al.
patent: 5780340 (1998-07-01), Gardner et al.
patent: 5814537 (1998-09-01), Maa et al.
patent: 5843827 (1998-12-01), Gregor et al.
Gurley Lynne A.
Niebling John F.
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