Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1994-12-16
1996-06-18
Weisstuch, Aaron
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429811, C23C 1435
Patent
active
055274382
ABSTRACT:
A sputtering apparatus deposits a material layer on a substrate. The apparatus includes a tube extending partially between the target and substrate, to selectively prevent portions of the target material flux from reaching the substrate to provide a more symmetrical deposition flux at each region of the substrate. In one aspect, the tube includes a single tubular wall which provides an inner and an outer particle blocking surface. The upper end of the inner surface of the tube is positioned to block, from the substrate edge, that portion of the sputtering target surface inward of the substrate edge which exceeds the target surface located outward of the substrate edge, and the lower surface of the outer wall is located to block access of particles sputtered from the edge of the target to the center of the substrate.
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Sputtering Apparatus, [Scope of claim for Patent] Publication Date Aug. 10, 1994 Kokai 63-310965.
Japanese Kokai Patent Application No. SHO 61[1986]-117273 (Translation) Publication Date Jun. 4, 1986.
Applied Materials Inc.
Patterson B. Todd
Streets Jeffrey L.
Verplancken Donald
Weisstuch Aaron
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