4. Semiconductor device manufacturing: process
  5. With measuring or testing
  6. Packaging or treatment of packaged semiconductor

Jicheng Yang

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Coupling spaced bond pads to a contact

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Coupling spaced bond pads to a contact

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate

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Coupling spaced bond pads to a contact

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Encapsulated sensor device

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Laser module and optical subassembly

Coherent light generators – Particular resonant cavity – Mirror support or alignment structure
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Profile ID: LFUS-PAI-P-2089321

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