Copper deposition chamber having integrated bevel clean with...

Details Copper deposition chamber having integrated bevel clean with... Copper deposition chamber having integrated bevel clean with...

2011-05-24

2011-05-24

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

Combined

C134S032000, C134S033000, C134S034000

Reexamination Certificate

active

07947131

ABSTRACT:
Embodiments of the invention generally provide apparatus and method for detecting and controlling edge bevel removal of a semiconductor substrate. One embodiment of the present invention provides an apparatus for inspecting a rotating substrate. The apparatus comprises a substrate support configured to support the rotating substrate on a back side and rotate the substrate about a central axis, and a sensor positioned above the substrate support, the sensor being configured to inspect a front side of the rotating substrate while moving simultaneously radially across the substrate.

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