Copper CVD precursors with enhanced adhesion properties

Details Copper CVD precursors with enhanced adhesion properties Copper CVD precursors with enhanced adhesion properties

2005-01-04

2005-01-04

Nazario-Gonzalez, Porfirio (Department: 1621)

Organic compounds -- part of the class 532-570 series

Organic compounds

Heavy metal containing

C556S012000, C556S040000, C556S112000, C427S587000, C427S248100

Reexamination Certificate

active

06838573

ABSTRACT:
This invention relates to copper(+1)(β-diketonate)(L) and related copper complexes such as copper (+1)(β-ketoiminate)(L) represented by the formula:wherein X represents O or NR9, R1and R3are each independently comprised of the group C1-8alkyl, C1-8fluoroalkyl, aryl, C1-8alkoxy, and C1-8alkyl ethers and R2is H, C1-8alkyl, C1-8alkoxy, and halogen, R9is C1-8alkyl, C1-8fluoroalkyl, phenyl, alkylphenyl, trialkylsilyl, and L represents a ligand having the structure:in-line-formulae description="In-line Formulae" end="lead"?(R4)(R5)C═(R6)(R7) or R4—C≡C—R7in-line-formulae description="In-line Formulae" end="tail"?wherein R4, is comprised of the group C1-8alkanol, C1-8alkoxyalkanol, C1-8unsaturated alkoxyalkanol, trialkylsilanol, C1-8aalkylamine, phenylamine; R5, R6, and R7are comprised of the group H, C1-8alkyl, triakylsilyl, alkoxy or phenyl.

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