Copper bonding compatible bond pad structure and method

Details Copper bonding compatible bond pad structure and method Copper bonding compatible bond pad structure and method

2006-05-31

2009-10-06

Chu, Chris C (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257SE23020, C257S781000, C257S782000, C257S784000, C438S612000, C438S614000

Reexamination Certificate

active

07598620

ABSTRACT:
A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions of non-conductive passivation material, the buffering structure providing buffering of underlying layers and structures of the device.

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