Copper alloys for chip and package interconnections

Details Copper alloys for chip and package interconnections Copper alloys for chip and package interconnections

1998-06-08

2000-05-16

Jones, Deborah

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

428674, 428336, 420469, 420489, 1741261, 438687, 439 55, B32B 1520, C22C 900, H01B 502, H01L 2144

Patent

active

060635061

ABSTRACT:
Copper alloys containing between 0.01 and 10 weight percent of at least one alloying element selected from carbon, indium and tin for improved electromigration resistance, low resistivity and good corrosion resistance that can be used in chip and package interconnections and a method of making such interconnections and conductors by first forming the copper alloy and then annealing it to cause the diffusion of the alloying element toward the grain boundaries between the grains in the alloy are disclosed.

REFERENCES:
patent: 130702 (1872-08-01), Dick
patent: 701429 (1902-06-01), Walter et al.
patent: 1538246 (1925-05-01), Kingsbury
patent: 1642348 (1927-09-01), Williams et al.
patent: 1960740 (1934-05-01), Gray
patent: 2002460 (1935-05-01), Wilkins
patent: 2046702 (1936-07-01), Scott
patent: 3091527 (1963-05-01), Pollock
patent: 3998633 (1976-12-01), Rhodes
patent: 4400351 (1983-08-01), Komori et al.
patent: 4586967 (1986-05-01), Shapiro et al.
patent: 4749548 (1988-06-01), Akatsu et al.
patent: 4908275 (1990-03-01), Tsuji et al.
patent: 5004520 (1991-04-01), Tsuji et al.
patent: 5021105 (1991-06-01), Asai et al.
patent: 5023698 (1991-06-01), Kobayashi
patent: 5077005 (1991-12-01), Kato
Patent Abstract of Japan, Feb. 22, 1989.
IBM Technical Disclosure Bulletin, Oct. 10, 1994, pp. 61-62, XP002098676, New York, U.S.
Patent Abstract of Japan, Jun. 13, 1989.
Miyafuji, "Copper Alloy "CAC65". . . " in Kobe Steel Engineering Reports, vol. 42 (1992) pp 67-70, (no month).
Stone, "On the Occurrence of the Semiconductor High Temp" in Mechanical Behavior of Materials, 1976, pp 1514-18 (no month).

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