Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Isolation by pn junction only
Reexamination Certificate
2007-08-07
2007-08-07
Nguyen, Thanh (Department: 2813)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Isolation by pn junction only
C438S730000, C438S676000, C257S029000
Reexamination Certificate
active
10142127
ABSTRACT:
A coplanar mounting member for a MEM sensor includes a first surface coplanar with a connection pad on the surface of a MEM sensor board containing the MEM sensor control circuit; a second surface inclined to the surface of the board for mounting a MEM sensor and an electrical conductor array for interconnecting the MEM sensor with the connection pad on the board.
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Anderson Richard S.
Hanson David S.
Marinis Thomas F.
Soucy Joseph W.
Iandiorio & Teska
Nguyen Thanh
The Charles Stark Draper Laboratory Inc.
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