Controlling resist profiles through substrate modification

Details Controlling resist profiles through substrate modification Controlling resist profiles through substrate modification

2006-01-31

2006-01-31

Goodrow, John L (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S313000, C430S327000

Reexamination Certificate

active

06991893

ABSTRACT:
Photoresists may be formed over a structure that has been modified so as to poison a lower layer of the photoresist. Then, when the photoresist is patterned, it is only patterned down to the poisoned layer. The poisoned layer may be removed subsequently. However, because of the use of the modification process, the critical dimensions of the photoresist may be improved in some embodiments.

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