Controlled selectivity etch for use with optical component...

Details Controlled selectivity etch for use with optical component... Controlled selectivity etch for use with optical component...

2006-02-28

2006-02-28

Duda, Kathleen (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making named article

C430S323000, C216S024000, C216S072000

Reexamination Certificate

active

07005247

ABSTRACT:
A method of fabricating an optical component includes forming a mask on an optical component precursor. The method also includes etching through at least a portion of the mask so as to etch an underlying medium concurrently with remaining mask and transfer a feature of an upper surface of the mask onto an upper surface of the underlying medium. The etch can be configured such that a ratio of the underlying medium etch rate to the mask etch rate is less than about 1.5:1. In some instances, the underlying medium is silicon and the mask is a photoresist.

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