Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Electron beam imaging
Patent
1998-02-19
1999-10-19
Young, Christopher G.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Electron beam imaging
216 38, G03C 500
Patent
active
059687100
ABSTRACT:
The present invention provides for the controlled rate of removal of common electron beam-curable materials, such as photoresists, from substrates, including silicon wafers in various stages of fabrication, by typical CMP processes and also provides a method of planing or otherwise altering the surface topography of a these substrates. The present invention utilizes typical CMP processes and common electron beam-curable materials to protect the underlying substrate surface from scratching and polishing away during the CMP processing. In addition, because of the ability in the present invention to precisely tailor the etch rates of the electron beam-curable material with that of the underlying substrate, substrates may be formed which have areas of electron beam-curable material which is either convex or concave to the plane of the substrate surface.
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Johnson Jeff
Whitman John
Micro)n Technology, Inc.
Young Christopher G.
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