Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-06-02
1995-10-10
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156345, 134 1, 20429834, 20429837, 118723E, 427569, H05H 100
Patent
active
054567963
ABSTRACT:
An RF signal is rapidly brought to a high power level prior to the introduction of a wafer into the reaction chamber to initiate a plasma that agitates and circulates any particles within the reaction chamber, thereby allowing effective reaction chamber cleaning; and an RF signal is slowly brought to a high power level to initiate a plasma prior to or during wafer processing to avoid disturbing and circulating such particles during wafer processing, thereby preventing particle induced contamination. A magnetic field may be applied to the reaction chamber to move particles from a plasma sheath/glow region interface to a reaction chamber exhaust line, and thereby prevent such particles from falling onto a processed wafer.
REFERENCES:
patent: 4761219 (1988-08-01), Sasaki et al.
patent: 4795529 (1989-01-01), Kawasaki et al.
patent: 4985112 (1991-01-01), Egitto et al.
G. Selwyn, Plasma particulate contamination control. I. Transport and Process Effects, 29 May 1991. pp. 3487-3492, J. Vac. Sci. Technol. B, vol. 9, No. 6 (Nov./Dec. 1992).
G. Selwyn, E. Patterson, Plasma particulate contamination control. II. Self-cleaning tool design, Journal of Vacuum Technology A. (Vacuums, Surfaces, and Films), vol. 10, No. 8, pt. 1, pp. 1053-1059 (Jul. 1992).
Gupta Anand
Lanucha Joseph
Ye Yan
Applied Materials Inc.
Dang Thi
Glenn Michael A.
Guenzer Charles
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