Control of etch selectivity

Details Control of etch selectivity Control of etch selectivity

1994-12-23

1997-11-04

Gorgos, Kathryn L.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

1566261, 216 60, C23F 102, H01L 21302

Patent

active

056835388

ABSTRACT:
Selective etching of separate materials in a manufacture of a device, such as a layer of silicon dioxide on a substrate of silicon in a semiconductor device, is accomplished in a reaction chamber having an RF electromagnetic field which interacts with plural etchants in gaseous phase to produce ions for etching the materials. The ratio of the concentration of etchants affect the relative rates of etching the respective materials. By pulsing the rf excitation waveform, intervals of deenergization of the field are produced repetitively wherein, during any one of these intervals, there is a decay in the concentration of each ionized etchant. Rates of decay and the resulting lifetimes differ for each of the etchants. Thereby, by adjustment of the duration of the deenergization interval, the average concentration of one etchant relative to the average concentration of a second etchant can be varied to attain selective etching of the materials. Continuous monitoring of etchant concentrations, as by ultraviolet absorption spectroscopy, permits automatic control of the modulation to attain a desired etch selectivity in real time.

REFERENCES:
patent: 4417822 (1983-11-01), Stein et al.
patent: 4500563 (1985-02-01), Ellenberger et al.
patent: 4647774 (1987-03-01), Brisk et al.
patent: 4919542 (1990-04-01), Nulman et al.
patent: 4956538 (1990-09-01), Moslehi
patent: 4979134 (1990-12-01), Arima et al.
patent: 4984902 (1991-01-01), Crowley et al.
patent: 5098197 (1992-03-01), Shepard et al.
patent: 5154512 (1992-10-01), Schietinger et al.
patent: 5156461 (1992-10-01), Moslehi et al.
patent: 5226732 (1993-07-01), Nakos et al.
patent: 5326171 (1994-07-01), Thompson et al.
patent: 5387777 (1995-02-01), Bennett et al.
Roozeboom, F., "Manufacturing Equipment Issues in Rapid Thermal Processing", Rapid Thermal Processing Science and Technology, Academic Press, Inc., 1993, pp. 380-381.

Affiliated with

Also associated with

Rating

Control of etch selectivity does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Control of etch selectivity, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Control of etch selectivity will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1829936