Control device for maintaining a chemical mechanical polishing m

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451 5, 451 36, 451285, 451287, B24B 2900

Patent

active

060993863

ABSTRACT:
The present invention provides a control device for maintaining a chemical mechanical polishing (CMP) machine in a wet mode, the CMP machine comprising a polishing pad, a slurry sprinkler for sprinkling liquid or deionized water, and at least one carrier head, the control device comprising a sensor positioned on the CMP machine for sensing the operational status of the slurry sprinkler and generating a corresponding sensing signal; and a control unit electrically connected to the sensor for measuring the time period over which the slurry sprinkler is closed wherein when the measured time period exceeds a predetermined length, the control unit will either send a warning signal or turn on the slurry sprinkler to sprinkle liquid onto the polishing pad according to a predetermined process so as to maintain the polishing pad in a wet mode.

REFERENCES:
patent: 5659492 (1997-08-01), Li et al.
patent: 5709593 (1998-01-01), Guthrie et al.
patent: 5762537 (1998-06-01), Sandhu et al.
patent: 5791970 (1998-08-01), Yueh
patent: 5857893 (1999-01-01), Olsen et al.

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