Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1997-05-28
1999-04-27
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429806, 20429808, 20429814, C23C 1434
Patent
active
058977538
ABSTRACT:
A method and an apparatus are disclosed for sputter deposition of an insulating material on a substrate in a continuous mode of operation. A novel design for an anode assembly and driving power supply is disclosed to permit this. Single or multiple anodes are used, which at any given time may be biased negatively with respect to the plasma, so that any insulating material which may have been deposited thereupon may be sputtered away so as to provide a clean positive anode to the system, and at least for some period of time is biased positively so that it acts as an anode. The removal of any insulating material which may have formed on the anode structure permits its continuing effective use in collecting electrons from the plasma when it is biased positively, and therefore its continuing effective use as an anode for the system, permitting continuous operation of the system.
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Schatz Douglas S.
Scholl Richard A.
Advanced Energy Industries Inc.
McDonald Rodney G.
Nguyen Nam
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