Contactor system for a ball grid array device

Details Contactor system for a ball grid array device Contactor system for a ball grid array device

1998-09-14

2000-06-13

Tran, Minh Loan

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

257 48, 257727, 257738, 257747, 257778, 361759, 361801, H01L 2358, H01L 21461, H01L 21469

Patent

active

060752556

ABSTRACT:
A contactor system is adapted for use when testing a ball grid array (BGA) device, and includes a conductive socket that is retained on a testing board and that establishes a ground connection therewith. The socket is formed with a receiving space adapted for receiving the BGA device therein. An insulating guide unit is mounted on the socket in the receiving space and is adapted to guide loading movement of the BGA device into the receiving space via an open top section of the latter and to prevent undesired electrical contact between the socket and the BGA device. A surface mount matrix is disposed on top of the testing board and is clamped between the socket and the testing board. The surface mount matrix is accessible via an open bottom section of the receiving space, and is adapted to contact solder balls on the BGA device directly so as to establish electrical connection between the BGA device and testing circuit layout on the testing board.

REFERENCES:
patent: 5570033 (1996-10-01), Staab
patent: 5578870 (1996-11-01), Farnsworth et al.
patent: 5646447 (1997-07-01), Ramsey et al.
patent: 5688127 (1997-11-01), Staab et al.
patent: 5892245 (1999-04-01), Hilton
patent: 5932891 (1999-08-01), Higashi et al.

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