Contact clean by remote plasma and repair of silicide surface

Semiconductor device manufacturing: process – Repair or restoration

Reexamination Certificate

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C438S658000, C438S906000, C257SE21582, C257SE21483

Reexamination Certificate

active

07867789

ABSTRACT:
Method for recovering treated metal silicide surfaces or layers are provided. In at least one embodiment, a substrate having an at least partially oxidized metal silicide surface disposed thereon is cleaned to remove the oxidized regions to provide an altered metal silicide surface. The altered metal silicide surface is then exposed to one or more silicon-containing compounds at conditions sufficient to recover the metal silicide surface.

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