Connector for testing a semiconductor package

Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C439S066000

Reexamination Certificate

active

07438563

ABSTRACT:
In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

REFERENCES:
patent: 4838347 (1989-06-01), Dentini et al.
patent: 5624268 (1997-04-01), Maeda et al.
patent: 5819406 (1998-10-01), Yoshizawa et al.
patent: 6181149 (2001-01-01), Godfrey et al.
patent: 6574114 (2003-06-01), Brindle et al.
patent: 6604953 (2003-08-01), Igarashi et al.
patent: 2005/0048695 (2005-03-01), Chia et al.
patent: 10-200242 (1998-07-01), None
patent: 2000-82511 (2000-03-01), None
patent: 2000-180504 (2000-06-01), None
patent: 2002-005992 (2002-01-01), None
patent: 20-0182523 (2000-03-01), None
patent: 2001-0065749 (2001-07-01), None
patent: 20-0247732 (2001-09-01), None
patent: 2002-0024419 (2002-03-01), None
patent: 20-0278989 (2002-06-01), None
patent: 2002-0079350 (2002-10-01), None
patent: 20-0312739 (2003-04-01), None
patent: 20-0368243 (2004-11-01), None
English language abstract of Korean Publication No. 20-0182523.
English language abstract of Korean Publication No. 20-0247732.
English language abstract of Korean Publication No. 20-0278989.
English language abstract of Korean Publication No. 2002-0024419.
English language abstract of Korean Publication No. 20-0312739.
English language abstract of Japanese Publication No. 2000-180504.
English language abstract of Japanese Publication No. 2002-005992.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Connector for testing a semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Connector for testing a semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connector for testing a semiconductor package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4003822

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.