Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2006-12-05
2006-12-05
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S734000, C257S735000, C257S773000, C257S776000, C257SE23020
Reexamination Certificate
active
07145252
ABSTRACT:
Configuration for testing the bonding positions of conductive drops and test method by using the same is disclosed. In the invention, a special configured contact pad for setting a conductive drop and an associated wire pattern are useful for knowing the drop condition of single or several displaying panels. The contact pad comprises at least two conductive members respectively coupled to two wires; and an isolating portion between conductive members for separation. The normal dropping position of a conductive drop on the contact pad includes at least a portion of the conductive members. Accordingly, the contact pad is originally an open-circuit without conductive drop thereon, but the contact pad is conductive when the contact drop sets on its normal dropping position. Whether the conductive drop forms on the normal dropping position of the contact pad is determined by measuring the electrical properties of the contact pad.
REFERENCES:
patent: 5894170 (1999-04-01), Ishikawa
patent: 6476506 (2002-11-01), O'Connor et al.
patent: 6650021 (2003-11-01), Stamper et al.
patent: 2004/0135250 (2004-07-01), Hung
Chi Mei Optoelectronics Corp.
Clark Jasmine
Thomas,Kayden,Horstemeyer&Risley
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