Configuration and fabrication of semiconductor structure...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S322000, C257SE21611

Reexamination Certificate

active

08030151

ABSTRACT:
A bipolar transistor (101) has a base (243) formed with an intrinsic base portion (2431), a base contact portion (245C), and a base link portion (243L) that extends between the intrinsic base portion and the base contact portion. An isolating dielectric layer (267-1 or 267-2) is provided above the base link portion. The length of the base link portion is determined, and thereby controlled, with a lateral spacing portion (269-1 or 269-2) of largely non-monocrystalline semiconductor material, preferably polycrystalline semiconductor material, provided on the dielectric layer above the base link portion. The lateral spacing portion is typically provided as part of a layer of non-monocrystalline semiconductor material used in the gate electrode of an insulated-gate field-effect transistor.

REFERENCES:
patent: 5719422 (1998-02-01), Burr et al.
patent: 5780912 (1998-07-01), Burr et al.
patent: 6548842 (2003-04-01), Bulucea et al.
patent: 6570242 (2003-05-01), Johnson
patent: 6803634 (2004-10-01), Okuno et al.
patent: 7211863 (2007-05-01), Williams et al.
patent: 7419863 (2008-09-01), Bulucea
patent: 7642574 (2010-01-01), Bulucea
patent: 2007/0187795 (2007-08-01), Langguth et al.
patent: 2008/0308878 (2008-12-01), Bulucea
patent: 2008/0311717 (2008-12-01), Bulucea
Alvarez,BiCMOS Technology and Applications(2d ed., Kluwer Acad. Publishers), 1993, pp. 75-78.
Chai et al., “A Cost-Effective 0.25μm LeffBiCMOS Technology Featuring Graded-Channel CMOS (GCMOS) and a Quasi-Self Aligned (QSA) NPN for RF Wireless Applications”,Procs. 2000 Bipolar/BiCMOS Circs. and Tech. Meeting, Sep. 24-26, 2000, pp. 110-113.
Tsui et al., “A Versatile Half-Micron Complementary BiCMOS Technology for Microprocessor-Based Smart Power Applications”,IEEE Trans. Elec. Devs., Mar. 1995, pp. 564-570.

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