CONDUCTIVE PARTICLES AND METHOD AND DEVICE FOR MANUFACTURING...

Details CONDUCTIVE PARTICLES AND METHOD AND DEVICE FOR MANUFACTURING... CONDUCTIVE PARTICLES AND METHOD AND DEVICE FOR MANUFACTURING...

2005-06-14

2005-06-14

Lam, Cathy F. (Department: 1775)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S779000, C252S513000, C252S514000, C428S407000

Reexamination Certificate

active

06906427

ABSTRACT:
An electrical connection is formed by using a double laminated conductive fine particle provided with a conductive metal layer on the surface of a spherical elastic base particle by electroless plating and electroplating and a layer of a low-melting-point metal on the surface of the conductive metal layer and wherein the conductive metal layer comprises a plurality of metal layers.

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F.A. Lowenhein, Electroplating, McGraw-Hill Book Company, New Your, pp 416-423, 1978.

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