Conductive-overlaid self-aligned MOS-gated semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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Details

257341, 257382, H01L 2976, H01L 2994, H01L 31062

Patent

active

055280633

ABSTRACT:
In a gated semiconductor device, a doped polysilicon layer overlies an insulated gate. The doped polysilicon layer extends over the top and the sidewalls of the gate to contact the underlying substrate. The dopants implanted in the polysilicon layer are diffused into the underlying substrate to form the source region in a self-aligned process which requires no extra masking step. The doped polysilicon layer, by contacting the source region and also overlying the gate, allows external electrical contact to be made directly to the doped polycrystalline silicon layer and to the surface of the substrate, eliminating the need for a special source contact adjacent to the gate. This conserves surface area of the device, allowing fabrication of a smaller and hence more economical device.

REFERENCES:
patent: 4375717 (1983-03-01), Tonnel
patent: 4417385 (1983-11-01), Temple
patent: 4598461 (1986-07-01), Love
patent: 5285094 (1994-02-01), Mori et al.

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