Conductive layers and fabrication methods thereof

Details Conductive layers and fabrication methods thereof Conductive layers and fabrication methods thereof

2006-11-14

2006-11-14

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S584000

Reexamination Certificate

active

07135394

ABSTRACT:
Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (<200° C.)

REFERENCES:
patent: 6036889 (2000-03-01), Kydd
patent: 2004/0076562 (2004-04-01), Manzanec et al.
patent: WO 99/43728 (1999-09-01), None

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