4. Inductor devices
  5. Coil or coil turn supports or spacers
  6. Printed circuit-type coil

Hong-Ching Lin

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active

Conductive layers and fabrication methods thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Conductive layers and fabrication methods thereof

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Multilayer-type chip common mode filter

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate

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RFID tag

Registers – Records – Conductive
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2481015

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