Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1995-04-27
1996-11-05
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257697, 257738, H01L 2348, H01L 2352, H01L 2940
Patent
active
055720692
ABSTRACT:
A semiconductor device assembly utilizing a grid array of conductive epoxy for connecting it to an electronic system. Conductive epoxy is screen printed in a desired pattern onto a printed wire board of the semiconductor device assembly. The conductive epoxy is B-staged by heating in an oven. The semiconductor device assembly is then placed onto a system printed circuit board wherein the B-staged conductive epoxy is further cured by heat and effectively makes mechanical and electrical connections between the semiconductor device assembly and the system printed circuit board.
REFERENCES:
patent: 3793709 (1974-02-01), Baumann
patent: 4661192 (1987-04-01), McShane
patent: 5468681 (1995-11-01), Pasch
Jr. Carl Whitehead
LSI Logic Corporation
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