Integrated circuit packages with heat dissipation for high curre

Details Integrated circuit packages with heat dissipation for high curre Integrated circuit packages with heat dissipation for high curre

1995-02-06

1996-11-05

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257675, 257704, 257706, 257707, H01L 2310, H01L 2312, H01L 2334

Patent

active

055720706

ABSTRACT:
An integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a beta-stageable resin which is preapplied to the lid and which contains a thermally conductive filler material. With the lid in place over the die and substrate board, the package is heated to cause the resin to flow and establish contact with the die. Further heating causes curing of the resin and a permanent thermal bridge between the die and the lid.

REFERENCES:
patent: 5396403 (1995-03-01), Patel
patent: 5455457 (1995-10-01), Kurokawa

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