Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2008-07-01
2008-07-01
Feely, Michael J (Department: 1796)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S038000, C134S042000, C523S400000, C525S523000, C525S529000, C525S530000, C525S533000
Reexamination Certificate
active
07393419
ABSTRACT:
A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.
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Berger Daniel George
Chioujones Kelly May
Daves Glenn Graham
Sachdev Krishna G.
Toy Hilton T.
Feely Michael J
Goodwin Kerry B.
International Business Machines - Corporation
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