Conductive adhesive rework method

Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents

Reexamination Certificate

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Details

C134S038000, C134S042000, C523S400000, C525S523000, C525S529000, C525S530000, C525S533000

Reexamination Certificate

active

07393419

ABSTRACT:
A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

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