Composition for underlying film and method of forming a pattern

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

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430325, 430328, 4302701, G03C 556, G03C 176

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active

060542543

ABSTRACT:
A method of forming a pattern which comprises the steps of forming an underlying film on a work film, forming a resist film on the underlying film, exposing the underlying film and the resist film to a patterning exposure light, and developing predetermined regions thus exposed of the resist film and the underlying film with a developing solution. The underlying film has a property that the solubility thereof to the developing solution can be changed by an action of an acid. The resist film and/or the underlying film contains a compound which is capable of generating the acid.

REFERENCES:
patent: 4863827 (1989-09-01), Jain et al.
patent: 5580702 (1996-12-01), Hayase et al.
patent: 5731126 (1998-03-01), Takemura et al.
patent: 5783361 (1998-07-01), Conley et al.
patent: 5795701 (1998-08-01), Conley et al.
patent: 5851738 (1998-12-01), Thackeray et al.
J. Sturtevant et al., "Removable Organic Antireflection Coating", SPIE, vol. 2724, pp. 738-746 (1996).

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