Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Making composite or hollow article
Patent
1991-12-17
1995-08-22
Walsh, Donald P.
Powder metallurgy processes
Powder metallurgy processes with heating or sintering
Making composite or hollow article
419 13, 419 19, 419 21, 252512, 252513, 252514, 252515, B22F 700, H01B 102, H01B 104
Patent
active
054437865
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a composition for the formation of ceramic vias and more particularly, to a paste composition to be used for the formation of vias of a ceramic substrate for mounting a semiconductor device, and a method of forming the vias by using the composition.
BACKGROUND ART
The increasing densification of the elements of a semiconductor device in recent years has led to a use for an increased densification of the wiring in a substrate on which these elements are mounted. Accordingly, it is now necessary to greatly reduce the size of the vias used for interphasic electric connections.
As the conventional methods of forming vias, there are known a method in which holes are bored in a green sheet with a drill, punch or laser and a paste filled into the thus-bored holes by screen printing; a method in which holes are bored in a green sheet covered with a carrier film, and a paste or powder filled into the thus-bored holes through the carrier film; and a method of forming vias by filling metallic balls directly into a green sheet.
The above methods of filling a paste or powder, however, have the following defects. When a paste is filled into the holes of a substrate or green sheet, organic components contained in the paste are decomposed and volatilized when the substrate or green sheet is calcined, and thus an insufficiently filled state of the vias occurs due to the volume loss of the paste or powder. Even when powder having a small volume loss is filled into holes for making vias, problems arise in that it is difficult to fill the powder into minute holes for vias and that the operating efficiency is lowered. These problems result in the formation of gaps at the interface between a conductor and substrate around the circumference of a via. Furthermore, a weak adhesion between a conductor and a substrate is a problem to be solved, and ideally these problems can be solved at the same time.
DISCLOSURE OF THE INVENTION
The present invention relates to a composition for the formation of ceramic vias, and its purpose is to settle the problems of the conventional via formation. These problems include gaps produced on the interface between a conductor and a substrate, as well as the weakness of the adhesion strength between the conductor and the substrate, both being a result of an insufficient filling of a filler into the vias. Such an insufficiently filled state of vias is due to a volume reduction of the filler after sintering, and a crux of the present invention resides in a composition for the formation of vias on a ceramic substrate.
The object of the present invention is to provide a composition for the formation of vias and a method of forming the vias by using the composition, whereby the problems such as gaps at the interface between a conductor and substrate and the weak adhesion between the conductor and substrate are solved.
At the present composition, there may be adopted, according to the kind of substrate and the organometallic compound used, a highly viscous or powdered solid composition consisting of a first component, i.e., a metallic powder, and a second component, i.e., 5 to 40 wt %, based on the weight of the metallic powder, of an organometallic compound.
Also according to the kind of the substrate and the organometallic compound used, it is possible to adopt a paste-like composition prepared by adding a third component, i.e., a heat decomposable organic binder, and a fourth component, i.e., a high boiling point organic solvent, to the above components.
The present method of forming ceramic vias is characterized in that holes are bored in a glass ceramic substrate, an alumina substrate, a magnesia substrate or zirconia substrate, or green sheets thereof, and the above-described composition is filled into the thus-formed holes, and thereafter, the substrate or green sheet is calcined.
The present composition for the formation of ceramic vias comprises the following components (a) and (b): powders of copper, gold, silver, tungsten, molybdenum, nickel
REFERENCES:
patent: 4346516 (1982-08-01), Yokouchi et al.
patent: 4576735 (1986-03-01), Kuroki et al.
patent: 4599277 (1986-07-01), Brownlow et al.
patent: 4885038 (1986-12-01), Anderson, Jr. et al.
patent: 4954926 (1990-07-01), Pepin
Kamehara Nobuo
Niwa Koichi
Omote Koji
Suzuki Hitoshi
Tsukada Mineharu
Chi Anthony R.
Fujitsu Limited
Walsh Donald P.
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