Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2008-01-01
2008-01-01
Walke, Amanda (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S273100, C430S286100
Reexamination Certificate
active
07314702
ABSTRACT:
A composition for a bottom-layer resist, having superior anti-refractivity and dry-etch resistance for use in a bi-layer resist process employing a light source at a wavelength of 193 nm or below, is disclosed. The composition for the bottom-layer resist contains a polymer represented by formula 1:In formula 1, R is hydrogen or a methyl group, m/(m+n) is about 0.5 to about 1.0 and n/(m+n) is 0 to about 0.5.
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English language abstract of JP 09-127691.
Englush Language machine translation of JP 2002-14474.
Hong Jin
Lee Sung-ho
Woo Sang-gyun
F. Chau & Associates LLC
Samsung Electronics Co,. Ltd.
Walke Amanda
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