Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2011-03-01
2011-03-01
Lee, Hsien-ming (Department: 2823)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S781000, C438S790000, C257S041000, C257SE51001, C257SE51027, C427S384000, C427S419500
Reexamination Certificate
active
07897519
ABSTRACT:
Disclosed is a composition for preparing an organic insulator, including an organic silane material, having a vinyl group, an acetylene group or an acryl group as a functional group for participating in a crosslinking reaction, a crosslinking agent, and a solvent for dissolving the above components. The organic insulator of example embodiments may be provided in the form of a solid insulating film, which may increase charge mobility while decreasing the threshold voltage and operating voltage of OTFTs, and which also may generate relatively slight hysteresis.
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Jeong Eun Jeong
Kim Joo Young
Lee Eun Kyung
Lee Sang Yoon
Son Kyung Seok
Harness & Dickey & Pierce P.L.C.
Lee Hsien-Ming
Samsung Electronics Co,. Ltd.
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