Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Patent
1998-08-28
2000-09-12
Dang, Thi
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
438729, 156345, H01L 2100, H05H 100
Patent
active
061173495
ABSTRACT:
A composite shadow ring for use in a plasma etch chamber that has a longer service life and can be readily replaced at a lower cost and a method for using such ring are disclosed. The composite shadow ring is constructed by a larger outer ring and a smaller inner ring which may be fabricated of quartz. The smaller inner ring has an upper planar surface for partially supporting an edge of an wafer and for exposing substantially to the gas plasma in the etch chamber. When the upper planar surface of the smaller inner ring is corroded by the gas plasma, the inner ring may be turned upside-down and reused, or when both sides have been corroded it can be readily replaced at a low cost without replacing the more expensive outer ring. The present invention composite shadow ring therefore presents a substantially lower cost shadow ring for use in an etching process than that possible with the conventional quartz shadow rings.
REFERENCES:
patent: 5955381 (1999-09-01), Bitting et al.
Chang Shuan Yu
Huang Yu Chih
Tsuei Cherng Chang
Dang Thi
Taiwan Semiconductor Manufacturing Company , Ltd.
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