Composite layer method for minimizing PED effect

Details Composite layer method for minimizing PED effect Composite layer method for minimizing PED effect

2008-05-06

2008-05-06

Huff, Mark F. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

C430S961000

Reexamination Certificate

active

10835218

ABSTRACT:
A novel composite layer structure method which is suitable for reducing post-exposure delay (PED) effects associated with fabricating a photolithography reticle or mask and eliminating or at least minimizing variations between intended and realized critical dimension values for a circuit pattern fabricated on the reticle or mask. The method includes providing a mask blank having a metal layer, providing a photoresist layer on the metal layer of the mask blank, providing a protective layer on the photoresist layer and photo-cracking the photoresist layer in the desired circuit pattern typically by electron beam exposure. During subsequent post-exposure delay periods, the protective layer prevents or minimizes Q-time narrowing of the photo-cracked photoresist, and consequently, prevents or minimizes narrowing of the critical dimension of a circuit pattern etched in the metal layer according to the width of the photo-cracked photoresist.

REFERENCES:
patent: 6107006 (2000-08-01), Chang
patent: 2002/0090577 (2002-07-01), Asanuma
patent: 2004/0033670 (2004-02-01), Yang et al.
patent: 2004/0048412 (2004-03-01), Nagai et al.
patent: 2004/0265706 (2004-12-01), Montgomery et al.

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