Composite flip chip semiconductor device with an interposer havi

Details Composite flip chip semiconductor device with an interposer havi Composite flip chip semiconductor device with an interposer havi

1992-11-27

1993-11-02

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257774, 257747, 361725, 361714, 361749, H01L 2348, H01L 2302, H02B 100, H05K 100

Patent

active

052586480

ABSTRACT:
A composite flip chip semiconductor device (10) permits burn-in testing and rework to be performed on the device while also enhancing electrical, thermal, and mechanical device performance. The device includes a semiconductor die (12) having a plurality of bonding pads (14). Also included in the composite device is an interposer (22) having a first surface with a plurality of traces (26). A plurality of vias (24) extend from the first surface of the interposer (22) to a second surface. The semiconductor die (12) is electrically coupled to the plurality of vias of the interposer which in turn is to be coupled to a substrate.

REFERENCES:
patent: 4074342 (1978-02-01), Honn et al.
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 4893174 (1990-01-01), Yamada et al.
patent: 4954878 (1990-09-01), Fox et al.

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