Composite charge storage structure formation in non-volatile...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C257S315000

Reexamination Certificate

active

07615447

ABSTRACT:
Semiconductor-based non-volatile memory that includes memory cells with composite charge storage elements is fabricated using an etch stop layer during formation of at least a portion of the storage element. One composite charge storage element suitable for memory applications includes a first charge storage region having a larger gate length or dimension in a column direction than a second charge storage region. While not required, the different regions can be formed of the same or similar materials, such as polysilicon. Etching a second charge storage layer selectively with respect to a first charge storage layer can be performed using an interleaving etch-stop layer. The first charge storage layer is protected from overetching or damage during etching of the second charge storage layer. Consistency in the dimensions of the individual memory cells can be increased.

REFERENCES:
patent: 5459091 (1995-10-01), Hwang
patent: 6040220 (2000-03-01), Gardner et al.
patent: 6066534 (2000-05-01), Son
patent: 6180454 (2001-01-01), Chang et al.
patent: 6746920 (2004-06-01), Wen et al.
patent: 6888755 (2005-05-01), Harari
patent: 7026684 (2006-04-01), Sakuma et al.
patent: 7049652 (2006-05-01), Mokhlesi et al.
patent: 2004/0238878 (2004-12-01), Sato et al.
patent: 2006/0208307 (2006-09-01), Chang et al.
patent: 2006/0286749 (2006-12-01), Tseng et al.
patent: 2007/0128787 (2007-06-01), Higashitani
patent: 2007/0243680 (2007-10-01), Harari et al.
patent: 2009/0055748 (2009-02-01), Dieberger et al.
Chan, et al., “A True Single Transistor Oxide-Nitride-Oxide EEPROM Device,” IEEE Electron Device Letters, vol. EDL-8, No. 3, Mar. 1987, pp. 93-95.
Nozaki, et al., “A 1-MbEEPROM with MONOS Memory Cell for Semiconductor Disk Application,” Journal of Solid State Circuits, vol. 26, No. 4, Apr. 1991 IEEE, pp. 497-501.
Choi, Yang-Kyu, et al., “Sublithographic nanofabrication technology for nanocatalysts and DNA chips,” J.Vac.Sci. Technol. B 21(6), American Vacuum Society, Nov/Dec 2003, pp. 2951-2955.
U.S. Appl. No. 11/623,314, filed Jan. 15, 2007.
U.S. Appl. No. 11/623,315, filed Jan. 15, 2007.
U.S. Appl. No. 11/765,866, filed Jun. 20, 2007.
U.S. Appl. No. 12/014,689, filed Jan. 15, 2008.
U.S. Appl. No. 11/960,485, filed Dec. 19, 2007.
U.S. Appl. No. 11/960,513, filed Dec. 19, 2007.
U.S. Appl. No. 11/960,518, filed Dec. 19, 2007.

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