4. Metal fusion bonding
  5. Process
  6. Plural joints

Chih-Chiang Chu

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Composite bump flip chip bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Composite bump flip chip bonding

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-727271

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