4. Electrolysis: processes, compositions used therein, and methods
  5. Electrolytic coating
  6. Depositing predominantly alloy coating

Tai-Hong Chen

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Composite bump

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Method for forming electrically conductive bumps and devices...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for interconnecting a flat panel display having a...

Liquid crystal cells – elements and systems – Particular structure – Having significant detail of cell structure only
Reexamination Certificate

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Method for preparing nickel-zinc-copper or nickel-zinc alloy ele

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating
Patent

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Method for repairing nickel-zinc-copper or nickel-zinc alloy ele

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly alloy coating
Patent

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