4. Metal fusion bonding
  5. With means to handle work or product
  6. Work portion comprises electrical component

R. Tracy White

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active

Compliant wirebond pedestal

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Compliant wirebond pedestal

Metal fusion bonding – With means to handle work or product – Work portion comprises electrical component
Reexamination Certificate

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Compliant wirebond pedestal

Metal fusion bonding – With means to handle work or product – Work portion comprises electrical component
Reexamination Certificate

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Compliant wirebond pedestal

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2818035

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