Coating for reducing contamination of substrates during...

Coating apparatus – Gas or vapor deposition – Work support

Reexamination Certificate

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C118S724000, C118S725000, C156S345510, C156S345520, C156S345530, C279S128000, C361S234000

Reexamination Certificate

active

07824498

ABSTRACT:
A substrate support has a support structure and a coating on the support structure having a carbon-hydrogen network. The coating has a contact surface having a coefficient of friction of less than about 0.3 and a hardness of at least about 8 GPa. The contact surface of the coating is capable of reducing abrasion and contamination of a substrate that contacts the contact surface. In one version, the support structure has a dielectric covering an electrode. A plurality of mesas on the dielectric have a coating with the contact surface thereon.

REFERENCES:
patent: 3789248 (1974-01-01), Jaecklin et al.
patent: 4987004 (1991-01-01), Yamazaki et al.
patent: 5032243 (1991-07-01), Bache et al.
patent: 5041201 (1991-08-01), Yamazaki et al.
patent: 5352493 (1994-10-01), Dorfman et al.
patent: 5458754 (1995-10-01), Sathrum et al.
patent: 5495979 (1996-03-01), Sastri et al.
patent: 5583736 (1996-12-01), Anderson et al.
patent: 5638251 (1997-06-01), Goel et al.
patent: 5669644 (1997-09-01), Kaihotsu et al.
patent: 5705262 (1998-01-01), Bou et al.
patent: 5718926 (1998-02-01), Dambrine et al.
patent: 5728465 (1998-03-01), Dorfman et al.
patent: 5786086 (1998-07-01), Frihart et al.
patent: 5812362 (1998-09-01), Ravi
patent: 5903428 (1999-05-01), Grimard et al.
patent: 5916370 (1999-06-01), Chang
patent: 5935323 (1999-08-01), Tanga et al.
patent: 5952060 (1999-09-01), Ravi
patent: 5969934 (1999-10-01), Larsen
patent: 5977519 (1999-11-01), Sorensen et al.
patent: 6001756 (1999-12-01), Takahashi et al.
patent: 6020036 (2000-02-01), Sugiyama et al.
patent: 6095084 (2000-08-01), Shamouilian et al.
patent: 6187704 (2001-02-01), Takahashi et al.
patent: 6191390 (2001-02-01), Sorensen et al.
patent: 6200675 (2001-03-01), Neerinck et al.
patent: 6214755 (2001-04-01), Otsuki et al.
patent: 6217969 (2001-04-01), Takahashi et al.
patent: 6228471 (2001-05-01), Neerinck et al.
patent: 6261370 (2001-07-01), Otsuki et al.
patent: 6386963 (2002-05-01), Kenji et al.
patent: 6447374 (2002-09-01), Sommer et al.
patent: 6472062 (2002-10-01), Neerinck et al.
patent: 6508911 (2003-01-01), Han et al.
patent: 6537429 (2003-03-01), O'Donnell et al.
patent: 6595506 (2003-07-01), Zide et al.
patent: 6740393 (2004-05-01), Massler et al.
patent: 6759800 (2004-07-01), Fernandez et al.
patent: 6853043 (2005-02-01), Yeh et al.
patent: 7160616 (2007-01-01), Massler et al.
patent: 7367872 (2008-05-01), Donohue
patent: 7407893 (2008-08-01), Seamons et al.
patent: 7638440 (2009-12-01), Wang et al.
patent: 2003/0047283 (2003-03-01), Parkhe et al.
patent: 2004/0055709 (2004-03-01), Boyd et al.
patent: 2005/0183669 (2005-08-01), Parkhe et al.
patent: 2005/0199585 (2005-09-01), Wang et al.
patent: 2005/0252454 (2005-11-01), Parkhe et al.
patent: 1178257 (1998-04-01), None
patent: 322812 (1989-07-01), None
patent: 0 322 812 (1989-11-01), None
patent: 0 806 798 (1997-11-01), None
patent: 63-285892 (1988-11-01), None
patent: 63285892 (1988-11-01), None
patent: 10-217103 (1998-08-01), None
patent: 10217103 (1998-08-01), None
patent: 293137 (1996-12-01), None
patent: 0466667 (2001-12-01), None
patent: WO-9845090 (1998-10-01), None
patent: WO 02/01611 (2002-01-01), None
patent: WO-2004/001799 (2003-12-01), None
patent: WO-2004010484 (2004-01-01), None
patent: WO-2005087974 (2005-09-01), None
patent: WO-2005/083752 (2006-01-01), None
“Custom Coating Solutions With Diamond-Like Coatings”, Bekaert Advanced Coating Technologies, Amherst NY, from http://www.bactusa.com/pdfs/LWC125folderfinal.pdf on Jan. 16, 2004.
“Custom Coating Solutions With Diamond-Like Coatings,” Bekaert Advanced Coating Technologies, Amherst, NY, from http://www.bactusa.com/pdfs/LWC125Brocker/pdf on Jan. 16, 2004.
News Release, “Bridgestone Develops Single Crystal Silicon Carbide Wafers for Semiconductor Devices”, Bridgestone, Dec. 2, 2003, from http://www.bridgestone.co.jp/english
ews/031203.html.
“PureBeta: Ultra High Purity Fine Ceramics (SiC) Component”, Bridgestone Corporation, Tokyo, Japan, from http://www.purebeta.com on Jan. 16, 2004.
“PureBeta”, Bridgestone Corporation, Tokyo, Japan, 2003 from http://www.purebeta.com/youto—e.html.
“Diamond-like carbon films”, IUPAC Compendium of Chemical Technology, 2nd edition, 1997.
“Discussion of chip manufacturing,” Bekaert Corporation, Amherst, NY, 2002 from http://www.bactusa.com/index.cfm?page=3a.
“E-Chucks,” Surmet Corporation, 2003 from http://www.surmet.com/echucks.html.
“Coatings,” Surmet Corporation, 2003 from http://www.surmet.com/coatings.html.
“Product Specification: TranSiMax(TM) Coating”, Surmet Corporation, http://www.surmet.com/docs/product—sheet—silicon1020Nitride.pdf on Jan. 16, 2004.
“Product Specification- Surmet Black Beauty”, Surmet Corporation, Burlington, MA, from http://www.surmet.com/docs/Product—Sheet—SBB.pdf on Jan. 16, 2004.
“Product Specification- UltraC Diamond (TM)”, Surmet Corporation, Burlington, MA, from http://www.surmet.com/docs/Product%20Sheet—UltraC%20Diamond.pdf on Jan. 16, 2004.
“Product Specification-UltraC-HT(TM)”, Surmet Corporation, Burlington, MA, from http://www.surmet.com/docs/Product—Sheet—UltraCHT.pdf on Jan. 16, 2004.
“Product Specification-Dust Free (TM) Ultra High Pure Silicon Coating (99.999%)”, Surmet Corp, Burlington, MA, from http://www.surmet.com/docs/Product—Sheet—UltraCHT.pdf on Jan. 16, 2004.
“Product Specification-SilcoMax (TM) Coating”, Surmet Corporation, Burlington, MA, from http://www.surmet.com/docs/Product—Sheet—S:C.pdf on Jan. 16, 2004.
“CVD-SiC Coating”, Mitsue Engineering & Shipbuilding Co., Ltd., Japan, 2001 from http://www.mes.co.jp/english/product/mecha/c05.html.
Van Landingham, “Review of Instrumented Indentation”, J. Res. Natl. Inst. Stand. Techno., Jul.-Aug. 2003, v.108, 249-265, Nat'l Inst. of Standards and Tech, Gaithersburg, MD.
ISR(Search Report), WIPO.
Diamonex Products, Diamond-Like Protective Coatings for Metals and Other Substrates, http://www.diamonex.com/products—dlc.htm (accessed Apr. 26, 2007).
Office Action dated Nov. 16, 2007 (Chinese Patent Office) in CN Patent App. No. 200580005773.8 entitled “Contaminant reducing substrate transport and support system”, China.
Office Action dated Jul. 18, 2008 (Chinese Patent Office) in CN Patent App. No. 200580005773.8 entitled “Contaminant reducing substrate transport and support system”, China.
Office Action dated Jan. 23, 2009 (Chinese Patent Office) in CN Patent App. No. 200580005773.8 entitled “Contaminant reducing substrate transport and support system”, China.
Office Action dated Nov. 3, 2008 (TIPO) in Taiwan Patent App. No. 94105456 entitled “Contaminant reducing substrate transport and support system”, Taiwan.
Office Action dated May 1, 2007 in U.S. Appl. No. 11/065,702 entitled “Contaminant reducing substrate transport and support system”.
Final Office Action dated Oct. 31, 2007 in U.S. Appl. No. 11/065,702 entitled “Contaminant reducing substrate transport and supp . . . ”.
Office Action dated Jun. 20, 2008 in U.S. Appl. No. 11/065,702 entitled “Contaminant reducing substrate transport and support system”.
Final Office Action dated Dec. 24, 2008 in U.S. Appl. No. 11/065,702 entitled “Contaminant reducing substrate transport and support system”.
“Introduction to Semiconductor Manufacturing Technology”, Hong Xiao, New Jersey, 2001.

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