CMP pad thickness and profile monitoring system

Details CMP pad thickness and profile monitoring system CMP pad thickness and profile monitoring system

2009-05-08

2011-10-25

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Optical characteristic sensed

C438S014000, C438S692000, C257SE21528, C257SE21583, C451S005000, C451S006000, C451S008000, C451S011000, C451S021000

Reexamination Certificate

active

08043870

ABSTRACT:
In one embodiment a method is provided for maintaining a substrate processing surface. The method generally includes performing a set of measurements on the substrate processing surface, wherein the set of measurements are taken using a displacement sensor coupled to a processing surface conditioning arm, determining a processing surface profile based on the set of measurements, comparing the processing surface profile to a minimum profile threshold, and communicating a result of the profile comparison.

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International Search Report and Written Opinion dated Dec. 28, 2009 for International Application No. PCT/US2009/043288.

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