CMP apparatus and method

Details CMP apparatus and method CMP apparatus and method

2007-06-12

2007-06-12

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S041000, C451S285000

Reexamination Certificate

active

10884371

ABSTRACT:
Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

REFERENCES:
patent: 6213853 (2001-04-01), Gonzalez-Martin et al.
patent: 6478665 (2002-11-01), Lofaro
patent: 6488565 (2002-12-01), White et al.
patent: 6558238 (2003-05-01), Crevasse et al.
patent: 2002/0177386 (2002-11-01), Smith
patent: 2003/0209320 (2003-11-01), Sommer
patent: 2005/0227595 (2005-10-01), Marquardt et al.
patent: 2005/0230354 (2005-10-01), Hardikar

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