CMOS well structure and method of forming the same

Details CMOS well structure and method of forming the same CMOS well structure and method of forming the same

2006-11-07

2006-11-07

Wilezewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

Having insulated gate

C438S222000, C438S224000, C438S202000, C438S227000, C438S228000

Reexamination Certificate

active

07132323

ABSTRACT:
A method for forming a CMOS well structure including forming a plurality of first conductivity type wells over a substrate, each of the plurality of first conductivity type wells formed in a respective opening in a first mask. A cap is formed over each of the first conductivity type wells, and the first mask is removed. Sidewall spacers are formed on sidewalls of each of the first conductivity type wells. A plurality of second conductivity type wells are formed, each of the plurality of second conductivity type wells are formed between respective first conductivity type wells. A plurality of shallow trench isolations are formed between the first conductivity type wells and second conductive type wells. The plurality of first conductivity type wells are formed by a first selective epitaxial growth process, and the plurality of second conductivity type wells are formed by a second selective epitaxial growth process.

REFERENCES:
patent: 6004861 (1999-12-01), Gardner et al.
patent: 6323103 (2001-11-01), Rengarajan et al.
patent: 6342413 (2002-01-01), Masuoka et al.
patent: 6482717 (2002-11-01), Hahn
patent: 6864128 (2005-03-01), Nishida et al.

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