Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent
1997-01-10
1998-11-17
Wojciechowicz, Edward
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
438251, 438275, 438286, 438308, 438519, 438522, 438530, 257336, 257344, 257369, 257372, 257408, H01L 2182
Patent
active
058375724
ABSTRACT:
An integrated circuit is provided having both NMOS transistors and PMOS transistors. The NMOS transistor junction regions are preferably formed before the PMOS transistor junction regions with pre-defined anneal temperatures applied after select implant steps. Both the NMOS and PMOS transistor junction are graded such that the drain areas include a relatively large LDD implant area and the source junctions do not. Whatever LDD area pre-existing in the source implanted with a higher concentration source/drain or MDD implant. The ensuing integrated circuit is therefore a CMOS circuit having asymmetrical transistor junctions and carefully controlled implant and anneal sequences. The asymmetrical junctions are retained, or at least optimized, by controlling the anneal temperatures such that diffusivity distances of n-type implants are relatively similar to p-type implants. Diffusivity is controlled by regulating the post-implant anneal temperatures of p-type implants lesser than previous n-type implants.
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Fulford Jr. H. Jim
Gardner Mark I.
Hause Fred N.
Advanced Micro Devices , Inc.
Daffer Kevin L.
Wojciechowicz Edward
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