Heating – Heating or heat retaining work chamber structure
Reexamination Certificate
2007-11-08
2011-11-08
Wilson, Gregory A (Department: 3749)
Heating
Heating or heat retaining work chamber structure
C118S729000, C219S443100
Reexamination Certificate
active
08052419
ABSTRACT:
Methods and apparatuses that decouple wafer temperature from pre-heat station residence time, thereby improving wafer-to-wafer temperature uniformity, are provided. The methods involve maintaining a desired temperature by varying the distance between the wafer and a heater. In certain embodiments, the methods involve rapidly approaching a predetermined initial distance and then obtaining and maintaining a desired final temperature using closed loop temperature control. In certain embodiments, a heated pedestal supplies the heat. The wafer-pedestal gap may be modulated may be varied by moving the heated pedestal and/or moving the wafer, e.g., via a movable wafer support. Also in certain embodiments, the closed loop control system includes a real time wafer temperature sensor and a servo controlled linear motor for moving the pedestal or wafer support.
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Gage Chris
Hamilton Shawn
Nordin Michael
Templeton Sheldon
Novellus Systems Inc.
Weaver Austin Villeneuve & Sampson LLLP
Wilson Gregory A
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